RB751V-40WS 200mw, low v f smd schottky barrier diod e small signal diode ? surface device type mounting ? moisture sensitivity level 1 ? pb free version and rohs compliant min max min max ? case : flat lead sod-323f small outline plastic package 1.15 1.40 0.045 0.055 2.30 2.80 0.091 0.110 0.25 0.40 0.010 0.016 1.60 1.80 0.063 0.071 0.80 1.10 0.031 0.043 0.05 0.15 0.002 0.006 package part no. packing sod-323f RB751V-40WS rr 3k / 7" reel sod-323f RB751V-40WS rrg 3k / 7" reel maximum ratings and electrical characteristics maximum ratings value units notes: 1. test condition : 8.3ms single half sine-wave superimposed on rated load (jedec method) 2. esd sensitive product hankling required. i o i fsm t stg 200 mw unit (inch) s8 a b suggested pad layou t ? terminal: matte tin plated, lead free., solderable per mil-std-202, method 208 guaranteed dimensions unit (mm) ordering information ? polarity : indicated by cathode band marking s8 ? weight :4.6 0.5 mg storage temperature range p d v rrm thermal resistance (junction to ambient) repetitive peak reverse voltage reverse voltage (dc) average forward current r ja rating at 25 c ambient temperature unless otherwise specified. sod-323f pin configuration c d e f ? low power loss, high current capability, low v f , low i r ? marking code : s8 features mechanical data ? green compound (halogen free) with suffix "g" on packing code and prefix "g" on date code ? high temperature soldering guaranteed: 260 c/10s non-repetitive peak forward surge current (note 1) v r type number power dissipation symbol -40~125 125 v 40 30 ma 30 v may vary despending on application. a c/w c junction temperature t j c 3. the suggested land pattern dimensions have been provided for reference only, as actual pad layouts 0.2 500 dimensions value (in mm) x x1 y 0.710 2.900 0.403 c a b d e f version : b10
RB751V-40WS 200mw, low vf smd schottky barrier diode small signal diode electrical characteristics junction capacitance tape & reel specification dimension(mm) note 1: a0, b0, and k0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. the component cannot rote more than 10o within the determined cavity. note 2: if b1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. w1 14.4 max. overall tape thickness t 0.6 max. tape width reel width w 8.30 max. sprocke hole position punch hole position sprocke hole pitch embossment center p1 3.50 0.05 4.00 0.10 2.00 0.10 f p0 sprocket hole reel outside diameter reel inner diameter feed hole width item carrier depth d a d1 max 0.5 symbol k 1.75 0.10 2.40 max. 1.50 +0.10 d2 178 1 50 min. 13.0 0.5 e units forward voltage v f - 0.37 v type number symbol typical reverse leakage current i r - i f =1.0ma v r = 30v ua v r =1v, f=1.0mhz c j 2-pf top cover tape carieer tape any additional label (if required) tsc label w1 d1 d2 a user ? direction ? of ? feed version : b10
RB751V-40WS 200mw, low vf smd schottky barrier diode small signal diode rating and characteristic curves 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 i f forward current (ma) fig 2 admissible power dissipation curve 0 50 100 150 200 250 300 0 20 40 60 80 100 120 140 power dissipation (mw) v f forward voltage (v) ambient tempeatature ( o c) reverse voltage (v) fig 1 typical forward characteristics fig 3 typical junction capacitance 0 1 2 3 4 5 02468101214 junction capacitance(pf) ta=25 o c 10 100 1000 10000 0 5 10 15 20 25 30 3 5 i r leakage current (na) fig. 4 typical reverse characteristics ta=25 o ta=125 o reverse voltage (v) version : b10
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